-
型号
厂家
封装
批号
数量
询价
-
TPA3002D2PHPR
TI
48-TQFP Exposed Pad
16+
26600
询价
-
TOP254MN
Power Integrations
SDIP-10C
17+
56230
询价
-
TPA3001D1PWPR
TI
24-TSSOP (0.173， 4.40mm Width) Exposed Pad
17+
16800
询价
-
TPA2025D1YZGR
TI
12-UFBGA， DSBGA
17+
86530
询价
-
TPA2018D1YZFR
TI
9-UFBGA， DSBGA
16+
26800
询价
-
TOP246R-TL
Power Integrations
TO-263-7C
17+
56230
询价
-
TPA2016D2YZHR
TI
16-UFBGA， DSBGA
16+
26600
询价
-
TPA2016D2RTJR
TI
20-WFQFN Exposed Pad
16+
26800
询价
-
TPA2015D1YZHR
TI
16-UFBGA， DSBGA
17+
16800
询价
-
TPA2014D1YZHR
TI
16-UFBGA， DSBGA
18+
36500
询价
